Bioelectricity

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Marc Thiriet

<p>The volumes in this authoritative series present a multidisciplinary approach to modeling and simulation of flows in the cardiovascular and ventilatory systems, especially multiscale modeling and coupled simulations. Volume 5 is devoted to cells, tissues, and organs of the cardiovascular and ventilatory systems with an emphasis on mechanotransduction-based regulation of flow. The blood vessel wall is a living tissue that quickly reacts to loads applied on it by the flowing blood. In any segment of a blood vessel, the endothelial and smooth muscle cells can sense unusual time variations in small-magnitude wall shear stress and large-amplitude wall stretch generated by abnormal hemodynamic stresses. These cells respond with a short-time scale (from seconds to hours) to adapt the vessel caliber. Since such adaptive cell activities can be described using mathematical models, a key objective of this volume is to identify the mesoscopic agents and nanoscopic mediators required to derive adequate mathematical models. The resulting biomathematical models and corresponding simulation software can be incorporated into platforms developed in virtual physiology for improved understanding and training.<br><br>Reviews structure and function of major constituents of the circulatory and respiratory apparatus<br><br>Describes major cellular processes involved in signaling, interactions, and adaptive responses of physiological conduits<br><br>Integrates biology, chemistry, and physics for the multidisciplinary exploration and modeling of physiological flows<br><br>Focuses on mechanotransduction-induced regulation</p>

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Melissa Abramovitz

Engineers design our modern world. They combine science and technology to create incredible vehicles, structures, and objects. This title examines amazing feats of biological engineering. Engaging text explores bionic legs, artificial organs, and animal cloning. It also examines the engineers who made these projects a reality and traces the history of the discipline.

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Xi Chen

<p><i>Mechanical Self-Assembly: Science and Applications</i> introduces a novel category of self-assembly driven by mechanical forces. This book discusses self-assembly in various types of small material structures including thin films, surfaces, and micro- and nano-wires, as well as the practice's potential application in micro and nanoelectronics, MEMS/NEMS, and biomedical engineering. The mechanical self-assembly process is inherently quick, simple, and cost-effective, as well as accessible to a large number of materials, such as curved surfaces for forming three-dimensional small structures. Mechanical self-assembly is complementary to, and sometimes offer advantages over, the traditional micro- and nano-fabrication. </p><p>This book also:</p><p>Presents a highly original aspect of the science of self-assembly</p><p>Describes the novel methods of mechanical assembly used to fabricate a variety of new three-dimensional material structures in simple and cost-effective ways</p><p>Provides simple insights to a number of biological systems and processes</p><p>Elucidates underlying mechanics principles of spontaneous pattern formations</p><p><i>Mechanical Self-Assembly: Science and Applications</i> is an ideal book for graduate students and engineers involved in the field of mechanical self-assembly.</p><p> </p><p> </p>

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Peter A. Sandborn, Hector Moreno

Conceptual Design of Multichip Modules and Systems treats activities which take place at the conceptual and specification level of the design of complex multichip systems. These activities include the formalization of design knowledge (information modeling), tradeoff analysis, partitioning, and decision process capture. All of these functions occur prior to the traditional CAD activities of synthesis and physical design. Inherent in the design of electronic modules are tradeoffs which must be understood before feasible technology, material, process, and partitioning choices can be selected. The lack of a complete set of technology information is an especially serious problem in the packaging and interconnect field since the number of technologies, process, and materials is substantial and selecting optimums is arduous and non-trivial if one truly wants a balance in cost and performance. Numerous tradeoff and design decisions have to be made intelligently and quickly at the beginning of the design cycle before physical design work begins. These critical decisions, made within the first 10% of the total design cycle, ultimately define up to 80% of the final product cost. Conceptual Design of Multichip Modules and Systems lays the groundwork for concurrent estimation level analysis including size, routing, electrical performance, thermal performance, cost, reliability, manufacturability, and testing. It will be useful both as a reference for system designers and as a text for those wishing to gain a perspective on the nature of packaging and interconnect design, concurrent engineering, computer-aided design, and system synthesis.