by Cher Ming Tan, Feifei He (2013)
Integrated circuit (IC) reliability is of increasing concern in present-day IC technology where the interconnect failures significantly increases the failure rate for ICs with decreasing interconnect dimension and increasing number of interconnect levels. Electromigration (EM) of interconnects has now become the dominant failure mechanism that determines the circuit reliability. This brief addresses the readers to the necessity of 3D real circuit modelling in order to evaluate the EM of interconnect system in ICs, and how they can create such models for their own applications. A 3-dimensional (3D) electro-thermo-structural model as opposed to the conventional current density based 2-dimensional (2D) models is presented at circuit-layout level.
Carl-Fredrik Mandenius, Nigel J Titchener-Hooker
Toc Sequence:10_2012_17310_2012_16710_2012_16910_2012_17010_2012_17410_2012_16610_2012_17110_2012_16810_2012_17210_2012_175 Please get the relevant chapter information from the production to place in the back cover.
Narottam P. Bansal, Aldo R. Boccaccini
"There is increasing interest in the application of ceramic materials in areas as diverse as transport, energy, environment and health. To address this trend, this single-source text supplies information on various processing and fabrication methods for advanced ceramics and ceramic composites with state-of-the-art research on methods, approaches, and techniques available for their processing and fabrication. A must-have for anyone pursuing this field, Processing of Ceramics and Composites tackles innovative technologies advancing the growing need for more reliable ceramic materials"-- "This is a comprehensive handbook of all the processing and fabrication methods for advanced ceramics and ceramic composites. Each chapter in the book is written by specialists and internationally renowned researchers in the field, and provides state-of-the-art research on methods, approaches, and techniques available for processing and fabrication of advanced ceramics and composites. It addresses materials heretofore uncovered by the literature, such as nanoceramics. The book includes a wide range of processing techniques for ceramics and composites, including traditional fabrication routes as well as modern approaches that are being developed to meet the increasing demand for more reliable materials in general"--
Teh Fu Yen
"This book aims at bridging the concepts and theory of chemistry with examples from fields of practical application, thus reinforcing the connection between science and engineering. Written primarily for use as a textbook for a university-level course, the topics covered here provide the fundamental tools necessary for an accomplished engineer." --Back Cover.
Victor Gutenmacher, N.B. Vasilyev
"This newly revised and expanded edition includes more than 200 theoretical and practical problems in which formal geometry provides simple and elegant insight, and the book points the reader toward important areas of modern mathematics." "Lines and Curves is well positioned for companion use with software packages like The Geometer's Sketchpad, and it can serve as a guidebook for engineers. Its deeper, interdisciplinary treatment is ideal for more theoretical readers, and the development from first principles makes the book accessible to undergraduates, advanced high school students, teachers, and puzzle enthusiasts alike."--BOOK JACKET.