Optical Response of Nanostructures

Sample

M. Oskar Deventer

Bidirectional transmission over optical fibre networks may yield a large cost reduction because of the reduction of the network infrastructure by a factor two and the potential cost reduction by an integrated transceiver design. It may also provide a cost-effective way to upgrade distribution networks by adding bidirectional channels. This book is the first to provide a comprehensive overview of bidirectional transmission in optical networks. It handles physical aspects: the behaviour of the fibre itself in bidirectional transmission transmission aspects: the behaviour and design of bidirectional systems and network aspects: the influence of bidirectional transmission on network design. £/LIST£ Practical guidelines are also given for bidirectional system design. Audience:This book is aimed at designers, builders and operators of optical networks, e.g. the manufacturers of optical transmission systems, public-network operators, developers of local-area networks, cable-television operators, etcetera. The intended level of readership is graduate level in physics or electrical engineering.

Sample

Dieter Radaj, Michael Vormwald

The book in hand presents advanced methods of brittle fracture and fatigue assessment. The Neuber concept of fictitious notch rounding is enhanced with regard to theory and application. The stress intensity factor concept for cracks is extended to pointed and rounded corner notches as well as to locally elastic-plastic material behaviour. The averaged strain energy density within a circular sector volume around the notch tip is shown to be suitable for strength-assessments. Finally, the various implications of cyclic plasticity on fatigue crack growth are explained with emphasis being laid on the DJ-integral approach. This book continues the expositions of the authors’ well known reference work in German language ‘Ermüdungsfestigkeit – Grundlagen für Ingenieure’ (Fatigue strength – fundamentals for engineers).

Sample

Xavier P. V. Maldague

This publication presents an up to date coverage of infrared thermography applied in the context of improved industrial activity and quality through automated inspection and control. It puts together concise and complete information on thermal non-destructive evaluation (NDE), a method for testing without damage, not yet available in an integrated, stand-alone format. All concepts discussed are explained in full and many industrial applications of the covered subjects are presented. Although the book is complete by itself extensive references to relevant research papers are given for further reading. Nondestructive Evaluation of Materials by Infrared Thermography is intended for a wide audience. It will help industrial engineers to implement nondestructive evaluation methods on the production line and enlarge their knowledge of industrial inspection techniques. It can also be used as a teaching aid at universities and colleges, especially in materials engineering curricula. Finally research centres will find it valuable as a reference book about thermal NDE.

Sample

Cher Ming Tan, Feifei He

Integrated circuit (IC) reliability is of increasing concern in present-day IC technology where the interconnect failures significantly increases the failure rate for ICs with decreasing interconnect dimension and increasing number of interconnect levels. Electromigration (EM) of interconnects has now become the dominant failure mechanism that determines the circuit reliability. This brief addresses the readers to the necessity of 3D real circuit modelling in order to evaluate the EM of interconnect system in ICs, and how they can create such models for their own applications. A 3-dimensional (3D) electro-thermo-structural model as opposed to the conventional current density based 2-dimensional (2D) models is presented at circuit-layout level.